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TCIL at METPACK 2008, 22 to 26 April 2008 at Messe Essen, Germany
The Tinplate Company of India Limited participated at METPACK 2008,
jointly with Corus Packaging Plus. The stall witnessed a huge footfall
with customers from across the world visited to have detailed
discussions with both CPP & TCIL on future business prospects. It was
quite heartening for TCIL to note that many new /prospective customers
showed their keen interest to commence business & provided detail
technical specifications of the products required by them, which matches
TCILs capability. TCILs growth project ETL-2, the state-of-the-Art new
combination line with Electrolytic Tinning & Tin Free Steel production,
which will enable TCIL to more than double its capacity to 380000 MT,
was also welcome by all customers are now eager to build relationship
with TCIL. The capability of TCIL to supply lacquered & printed
tinplate, over & above plain tinplate, is perceived as a competitive
advantage in the international market, vis--vis other tinplate
suppliers & we had received fresh enquiries for supply of lacquered
sheets. TCILs domestic customers from India also had visited the stall.
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METPACK is the most coveted gathering for metal packaging professionals
from across the whole world. Its position as the leading international
trade fair for the industry is uncontested. An ideal platform for
buyers, manufacturers and solution providers to seek partners for their
varied requirements under one roof. Along with Metpack, the APEAL
Conference was also held in Dusseldorf on 24th April 2008.
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